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EVG®150 Automated Resist Processing System up to 300mm

Fully-automated coat/develop process and high-throughput performance.

With up to four spin modules and a cassette-to-cassette handling system, the EVG150 allows for a fully-automated coat/develop process and high-thoroughput performance. Along with high spin speeds and coating chambers with closed lids, the EVG150 produces highly uniform coats and improves repeatability to suit these needs. Wafers with high topography can be uniformly coated by OmniSpray® technology, where traditional spin coating encounters limitations more info.....