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EVG®850TB Automated Temporary Bonding System

For temporary bonding of a substrate on a rigid carrier.

 

The temporary bonding process includes the application of the intermediate material on the carrier wafer before assembly is done in a bond chamber.

The different types of intermediate materials, e.g. thermo-plast adhesives, waxes, resists or tapes require different technologies to apply them on the wafer.

For liquid materials like adhesives, waxes and resists, a spin coating process is used traditionally. The process usually includes spin coating followed by a bake step before the bonding takes place. As for dry film tapes, the tape will be laminated onto the substrate in a lamination station before the final bonding step with the device wafer takes place more info...