Zinota

You are here : Products > Bonding > Temporary Bonding Systems > EVG®820 Lamination System

EVG®820 Lamination System

For punching and lamination of dry adhesive tape on carrier wafer.

The EVG820 Lamination Station is used for automated, stress-free lamination of any kind of dry adhesive film onto the carrier wafer. This unique lamination technology performs punching of the adhesive tape supplied on a roll, followed by alignment and lamination. The Material usually is a double-side adhesive tape, either thermal- or UV- release. With punching technology size and dimension of tape are freely selectable and independent from substrate more info....