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EVG®20 IR Inspection System

For wafer bond quality inspection.

For qualification of bond quality after pre-bonding, the IR Inspection System gives first information on the bond quality via a stored image. A uniform illumination system and an IR sensitive CCD camera are the main components of the IR-inspection station. Video frame grabbing technology displays the camera image on the process monitor. The image of each wafer can be optionally stored on hard disk drive as graphic file more info....