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EVG®610 Semi-automated Mask Alignment System

For wafer-to-wafer alignment for subsequent wafer bonding applications.

 

The EVG®610 is a highly flexible R&D system that can handle small substrate pieces and wafers up to 200 mm. The tool supports a variety of standard lithography processes, such as vacuum-, soft-, hard- and proximity exposure mode, as well as other specific applications, including bond alignment, nano imprint lithography (NIL) and micro contact printing. The system offers quick re-tooling with a conversion time of less than one minute, making it ideal for universities, R&D and small-volume production applications more info.......