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EVG®750 Automated Hot Embossing System

For hot embossing applications of polymer substrates and spin-on polymers with excellent pattern fidelity.

The EVG750 is designed for high volume embossing and nanoimprinting applications of spin-on polymers as well as polymer substrates. It combines an alignment module, a high contact force imprinting module and a de-embossing station in a fully automated system targeting mainly microfluidic applications more info....