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EVG®520L3 Semi-Automated High-Vacuum Wafer Bonding System

 

 

The EVG520L3 equipment name extension L3 stands for Linear Load Lock. It features the capability of separating process steps in order to gain throughput and improve process capabilities, especially for high vacuum bonding applications. Furthermore the system includes up to 100kN high force bonding capability. Due to its pre-processing chamber and the transfer system between chambers the EVG520L3 is capable of executing processes under high-vacuum, since substrate will not get in contact with surrounding environment more info....