Zinota

You are here : Products > Bonding > Wafer Bonding Systems > EVG®560 HBL Fully Automated Wafer Bonding System for HB-LED

EVG®560 HBL Fully Automated Wafer Bonding System for HB-LED

Configurable for all wafer bonding processes such as eutectic, thermo compression, fusion bonding, or LowTemp plasma bonding.

The EVG®560 HBL is a dedicated, fully automated wafer bonding system for High-Brightness LED (HB-LED) manufacturing. The flexible tool supports metal, adhesive and fusion bonds of various substrate types. Cassette-to-cassette operation, multisubstrate bonding capability and a modular design with up to four swap-in process modules make the EVG®560 HBL the perfect solution for high-volume HB-LED manufacturing. EVG's field proven wafer bonding technology, as well as our unique approach to low temperature metal wafer bonding, results in highest throughput and yields more info....