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SPTS’ Sigma® fxP™ is a single wafer cluster tool designed for high-volume Physical Vapor Deposition (PVD) processing. The cluster architecture of the Sigma® fxP™ sputter deposition system offers excellent process control with high throughput. Deposition process modules are based on a standard design that enables simple technology upgrades and wafer size conversion.
Process Modules
  • Heat – Lamp driven wafer degas module
  • Soft Etch – ICP sputter etch module for surface pre-treatment and via clean prior to metal deposition
  • Standard PVD – conventional DC and pulsed DC sputter module for deposition of a wide range of materials
  • Hi-Fill PVD – long throw deposition module with increased target to substrate spacing offering improved bottom coverage for high aspect ratio structures
  • Advanced Hi-Fill PVD – ionized variant of the Hi-Fill chamber delivering outstanding bottom and sidewall coverage for the most challenging high aspect ratio structures at the lowest Cost of Ownership (CoO)
  • C3M – MOCVD TiN to deliver virtually conformal liner coverage in deep structures at wafer temperatures ‹ 350°C
Applications include:
  • Back-end Silicon Interconnect
  • Thick frontside metals for power applications
  • Backside metals for power applications
  • Compound and Micro/Nanotech
  • Compound metal applications
  • Highly oriented Aluminum Nitride for bulk acoustic wave (BAW) devices

More info....